What Industries Commonly Use High Density Interconnects?
Commonly Use High Density Interconnects
High density interconnect (HDI) is a method of producing printed circuit boards that has the capability to accommodate a higher level of connectivity within a smaller footprint. Its use can dramatically improve an electronic product’s performance and functionality. HDI technology is particularly useful in electronics with complex, compact form factors, such as mobile phones, tablets, laptop computers, and touch screen products. It is also commonly used in healthcare devices such as pacemakers and portable X-rays, and in automotive electronics.
PCBs are multi-layer electronic circuit boards that contain a series of conductive tracks, called “vias,” that connect components throughout the board. The vias can be made from a variety of materials, including copper. However, the most effective vias are made of low-loss laminates, specialized dielectrics, and precise etching and plating processes to provide reliable performance and manufacturability.
Conventional PCBs can meet most of today’s requirements, but to meet the growing demand for denser and more complex electronic products, new technologies are necessary. high density interconnect are designed to meet this need by using advanced fabrication techniques to produce PCBs with increased component density and more efficient signal transmission.
What Industries Commonly Use High Density Interconnects?
Unlike conventional PCBs, which consist of only one layer, HDI PCBs have multiple layers and utilize laser-formed microvias to create a high-density interconnection system. These microvias are also known as blind or buried vias, and they allow a greater amount of complex and compact circuitry to be included in the PCB while retaining the same physical size.
This allows for faster and more efficient signal transmission, reduces noise, and enhances signal timing. The result is an overall improvement in the quality of the board. These benefits make it an ideal choice for applications that require a small form factor but need to have a large number of connected components, such as telecommunications equipment and routers.
Additionally, HDI PCBs are ideal for use in the aerospace and defense industries, where they can withstand harsh environmental conditions and have an increased lifespan. The military has also begun to adopt the technology in its devices, as it can reduce the size and weight of critical military equipment while maintaining the same level of performance.
The market for high density interconnects is projected to grow at a fast pace over the next few years. This is due to increasing adoption of electronics in automotive, medical, and consumer devices. APAC is expected to account for the largest share of the global market, which can be attributed to the expanding telecommunications networks in China, India, and South Korea, as well as the growing demand for consumer electronics and advanced devices such as smartphones and tablets. In addition, the aging population in APAC is driving growth of the healthcare and medical industry, which is also creating an increase in the use of electronic devices such as smart watches and medical devices.